题目：Recent Advances on Polymers and Polymer Nanocomposites  for Advance Electronic and Photonic Packaging Applications
报告人：  C.P. Wong  教授、美国工程院院士
School of Materials Science and Engineering
Georgia Institute of Technology, Atlanta

报告内容摘要：
The advances of semiconductor technology is mainly due to the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non conductive), interlayer dielectrics(low k, low loss  dielectrics), encapsulants(discrete, wafer level packaging) , embedded passives(high K and high Q materials), superhydrophobic self-cleaning lotus effect surfaces,...etc. In this presentation, we will review some of the recent advances of polymeric materials and polymer nanocomposites that we are currently being investigated for these types of applications, such as lead-free electrically conductive adhesives (ECAs) for fine pitch and high current density interconnects, flip chip and wafer level underfills, reworkable underfills, as well as nano composites for  high k embedded capacitors and inductors for RF/wireless, and superhydrophobic self-clean surface applications.

主持人：陈十一  教授
时间：12月22日（周一）下午3:30
地点：化学老楼多功能厅(化学楼西区二层)

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联系人： 侯仰龙 特聘研究员   010-82529028